Hefei Chipmore Technology Co.,Ltd. operates as a packaging and testing service provider for integrated circuits. The company offers packaging and testing solutions, including bump processing, wafer testing, grinding and cutting, packaging and testing, etc., as well as supporting services, such as mask design, design and maintenance of probe cards, thin film flip chip tape design, and test program development. Its packaging and testing products include various display driver chips, power management chips, RF front-end chips, etc. used in smart phones, tablets, laptops, high-definition TVs, smart wearables, and other fields. The company was founded in 2004 and is based in Hefei, China.
Metrics to compare | 688352 | Sector Sector - Average of metrics from a broad group of related Industrials sector companies | Relationship Relationship688352PeersSector | |
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P/E Ratio | 51.2x | 49.5x | 11.8x | |
PEG Ratio | −1.30 | 0.18 | 0.01 | |
Price/Book | 2.3x | 3.1x | 2.4x | |
Price / LTM Sales | 6.8x | 6.5x | 2.2x | |
Upside (Analyst Target) | - | 11.7% | 18.7% | |
Fair Value Upside | Unlock | 10.6% | 5.2% | Unlock |