Metrics to compare | 3374 | Sector Sector - Average of metrics from a broad group of related Technology sector companies | Relationship Relationship3374PeersSector | |
|---|---|---|---|---|
P/E Ratio | 54.3x | 91.9x | 12.1x | |
PEG Ratio | −3.14 | 2.02 | 0.01 | |
Price/Book | 7.5x | 6.4x | 2.4x | |
Price / LTM Sales | 10.0x | 4.9x | 2.3x | |
Upside (Analyst Target) | −27.0% | −31.8% | 29.8% | |
Fair Value Upside | Unlock | −26.5% | 6.6% | Unlock |
Xintec Inc. operates as a wafer level chip scale packaging company in Asia, the United States, and Europe. The company provides wafer level chip scale packaging, wafer-level back cover packaging, and testing services for semiconductors. It also offers optical sensor chip scale packaging services comprising side-wall interconnect and through silicon via XinTSV, various glass thickness and filters, and glass bonding to wafer with or without cavity; FSI/BSI/stack wafer reconstruction for mobile, automotive, and consumer applications; and specialty RW service with a glass lid for automotive applications. In addition, the company provides micro-electromechanical systems sensor packaging services, such as wafer thinning and bonded wafer partial dicing to reveal bonding pad; CSP, using via last TSV to connect pad on wafer surface toward backside; and dry etching silicon to form large cavities to derive product performance needs; as well as 3D I/O redistribution, power ground enhancement, and dual side connection services. Xintec Inc. was founded in 1987 and is headquartered in Taoyuan City, Taiwan.