Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning, dicing, and tape-and-reel processes, as well as chip-on-film, chip on glass, chip-on-plastic, packaging attachment, and wafer level chip scale packaging services. It also provides compound semiconductors including SiGe, GaAs, GaN, SiC, and other wafers; flexible tape-and-reel circuit substrate; and chip tray. In addition, it develops, manufactures, packages, tests, sells, and after-sale services of integrated circuit and special materials for semiconductors; invests in, develops, manufactures, and sells electronic components; and manufactures and sales elements. Chipbond Technology Corporation was incorporated in 1997 and is based in Hsinchu City, Taiwan.
Metrics to compare | 6147 | Sector Sector - Average of metrics from a broad group of related Technology sector companies | Relationship Relationship6147PeersSector | |
|---|---|---|---|---|
P/E Ratio | 17.2x | 39.3x | 12.1x | |
PEG Ratio | −0.52 | −4.01 | 0.01 | |
Price/Book | 1.0x | 1.7x | 2.4x | |
Price / LTM Sales | 2.2x | 1.4x | 2.3x | |
Upside (Analyst Target) | −14.3% | 15.7% | 33.9% | |
Fair Value Upside | Unlock | 15.4% | 8.4% | Unlock |