BE Semiconductor Industries NV (BESI)

75.52
-0.08(-0.11%)
  • Volume:
    105,824
  • Bid/Ask:
    0.00/0.00
  • Day's Range:
    74.06 - 76.08

BESI Overview

Prev. Close
75.6
Day's Range
74.06-76.08
Revenue
722.87M
Open
75.12
52 wk Range
38.46-84.9
EPS
3.03
Volume
105,824
Market Cap
5.94B
Dividend (Yield)
2.85
(3.87%)
Average Volume (3m)
626,492
P/E Ratio
24.87
Beta
1.48
1-Year Change
-4.23%
Shares Outstanding
78,487,926
Next Earnings Date
25 Apr 2023
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BE Semiconductor Industries NV Company Profile

BE Semiconductor Industries NV Company Profile

BE Semiconductor Industries N.V. engages in the development, manufacture, marketing, sale, and service of semiconductor assembly equipment for the semiconductor and electronics industries worldwide. The company’s principal products include die attach equipment, such as single chip, multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra-thin, and wafer level molding, as well as trim and form, and singulation systems. Its principal products also comprise plating equipment, such as tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company’s principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. The company was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

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